? semiconductor components industries, llc, 2009 august, 2009 ? rev. 1 1 publication order number: NTMFS4936N/d NTMFS4936N power mosfet 30 v, 79 a, single n ? channel, so ? 8 fl features ? low r ds(on) , low capacitance and optimized gate charge to minimize conduction, driver and switching losses ? these devices are pb ? free, halogen free/bfr free and are rohs compliant applications ? cpu power delivery ? dc ? dc converters maximum ratings (t j = 25 c unless otherwise stated) parameter symbol value unit drain ? to ? source voltage v dss 30 v gate ? to ? source voltage v gs 20 v continuous drain current r ja (note 1) steady state t a = 25 c i d 19.5 a t a = 100 c 12.3 power dissipation r ja (note 1) t a = 25 c p d 2.62 w continuous drain current r ja 10 s (note 1) t a = 25 c i d 35 a t a = 100 c 22 power dissipation r ja 10 s (note 1) t a = 25 c p d 8.4 w continuous drain current r ja (note 2) t a = 25 c i d 11.6 a t a = 100 c 7.3 power dissipation r ja (note 2) t a = 25 c p d 0.92 w continuous drain current r jc (note 1) t c = 25 c i d 79 a t c =100 c 50 power dissipation r jc (note 1) t c = 25 c p d 43 w pulsed draincurrent t a = 25 c, t p = 10 s i dm 235 a current limited by package t a = 25 c i dmax 100 a operating junction and storage temperature t j , t stg ? 55 to +150 c source current (body diode) i s 39.2 a drain to source dv/dt dv/d t 6.0 v/ns single pulse drain ? to ? source avalanche energy (t j = 25 c, v dd = 50 v, v gs = 10 v, i l = 44 a pk , l = 0.1 mh, r g = 25 ) e as 96.8 mj lead temperature for soldering purposes (1/8 from case for 10 s) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. surface ? mounted on fr4 board using 1 sq ? in pad, 1 oz cu. 2. surface ? mounted on fr4 board u sing the minimum recommended pad size. so ? 8 flat lead case 488aa style 1 marking diagram http://onsemi.com a = assembly location y = year ww = work week = pb ? free package (note: microdot may be in either location) 4936n ayww 1 v (br)dss r ds(on) max i d max 30 v 4.0 m @ 10 v 79 a 5.5 m @ 4.5 v g (4) s (1,2,3) n ? channel mosfet d (5,6) device package shipping ? ordering information NTMFS4936Nt1g so ? 8 fl (pb ? free) 1500 / tape & reel NTMFS4936Nt3g so ? 8 fl (pb ? free) 5000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. s s s g d d d d
NTMFS4936N http://onsemi.com 2 thermal resistance maximum ratings parameter symbol value unit junction ? to ? case (drain) r jc 2.9 c/w junction ? to ? ambient ? steady state (note 3) r ja 47.7 junction ? to ? ambient ? steady state (note 4) r ja 135.2 junction ? to ? ambient ? (t 10 s) (note 3) r ja 14.8 3. surface ? mounted on fr4 board using 1 sq ? in pad, 1 oz cu. 4. surface ? mounted on fr4 board using the minimum recommended pad size. electrical characteristics (t j = 25 c unless otherwise specified) parameter symbol test condition min typ max unit off characteristics drain ? to ? source breakdown voltage v (br)dss v gs = 0 v, i d = 250 a 30 v drain ? to ? source breakdown voltage temperature coefficient v (br)dss / t j tbd mv/ c zero gate voltage drain current i dss v gs = 0 v, v ds = 24 v t j = 25 c 1.0 a t j = 125 c 10 gate ? to ? source leakage current i gss v ds = 0 v, v gs = 20 v 100 na on characteristics (note 5) gate threshold voltage v gs(th) v gs = v ds , i d = 250 a 1.2 1.6 2.0 v negative threshold temperature coefficient v gs(th) /t j 4.0 mv/ c drain ? to ? source on resistance r ds(on) v gs = 10 v i d = 30 a 2.9 4.0 m i d = 15 a 2.9 v gs = 4.5 v i d = 30 a 3.9 5.5 i d = 15 a 3.9 forward transconductance g fs v ds = 1.5 v, i d = 15 a 50 s charges, capacitances & gate resistance input capacitance c iss v gs = 0 v, f = 1 mhz, v ds = 15 v 3044 pf output capacitance c oss 1014 reverse transfer capacitance c rss 39 total gate charge q g(tot) v gs = 4.5 v, v ds = 15 v; i d = 30 a 19 nc threshold gate charge q g(th) 4.6 gate ? to ? source charge q gs 9.2 gate ? to ? drain charge q gd 2.4 total gate charge q g(tot) v gs = 10 v, v ds = 15 v; i d = 30 a 43 nc switching characteristics (note 6) turn ? on delay time t d(on) v gs = 4.5 v, v ds = 15 v, i d = 15 a, r g = 3.0 15.5 ns rise time t r 20.6 turn ? off delay time t d(off) 24.6 fall time t f 7.0 5. pulse test: pulse width 300 s, duty cycle 2%. 6. switching characteristics are independent of operating junction temperatures.
NTMFS4936N http://onsemi.com 3 electrical characteristics (t j = 25 c unless otherwise specified) parameter unit max typ min test condition symbol switching characteristics (note 6) turn ? on delay time t d(on) v gs = 10 v, v ds = 15 v, i d = 15 a, r g = 3.0 10.4 ns rise time t r 19 turn ? off delay time t d(off) 29 fall time t f 8.0 drain ? source diode characteristics forward diode voltage v sd v gs = 0 v, i s = 30 a t j = 25 c 0.8 1.1 v t j = 125 c 0.65 reverse recovery time t rr v gs = 0 v, dis/dt = 100 a/ s, i s = 30 a 39 ns charge time t a 21.5 discharge time t b 17.5 reverse recovery charge q rr 36 nc package parasitic values source inductance l s t a = 25 c 0.65 nh drain inductance l d 0.005 nh gate inductance l g 1.84 nh gate resistance r g 1.1 2.0 5. pulse test: pulse width 300 s, duty cycle 2%. 6. switching characteristics are independent of operating junction temperatures.
NTMFS4936N http://onsemi.com 4 typical characteristics 0 20 40 60 80 100 120 140 01234 v ds , drain ? to ? source voltage (v) i d , drain current (a) figure 1. on ? region characteristics v gs = 3.8 v 2.8 v 3.0 v 3.2 v 3.4 v 3.6 v 2.4 v 2.6 v 4.0 v 4.5 v to 10 v 0 20 40 60 80 100 120 140 1 1.5 2 2.5 3 3.5 4 t j = 25 c t j = ? 55 c t j = 125 c v gs , gate ? to ? source voltage (v) figure 2. transfer characteristics i d , drain current (a) v ds = 10 v 0.002 0.003 0.004 0.005 0.006 0.007 0.008 0.009 0.010 0.011 0.012 2.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5 figure 3. on ? resistance vs. gate ? to ? source voltage v gs , gate ? to ? source voltage (v) r ds(on) , drain ? to ? source resistance ( ) i d = 30 a t j = 25 c 0.002 0.0025 0.003 0.0035 0.004 0.0045 0.005 0.0055 0.006 20 30 40 50 60 70 80 90 100 110 120 130 1 4 figure 4. on ? resistance vs. drain current and gate voltage i d , drain current (a) r ds(on) , drain ? to ? source resistance ( ) v gs = 4.5 v v gs = 10 v t j = 25 c 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 ? 50 ? 25 0 25 50 75 100 125 150 figure 5. on ? resistance variation with temperature t j , junction temperature ( c) r ds(on) , drain ? to ? source resistance (normalized) i d = 30 a v gs = 10 v 10 100 1000 10000 5 1015202530 figure 6. drain ? to ? source leakage current vs. voltage v ds , drain ? to ? source voltage (v) i dss , leakage (na) v gs = 0 v t j = 150 c t j = 125 c t j = 85 c 3.5
NTMFS4936N http://onsemi.com 5 typical characteristics 0 400 800 1200 1600 2000 2400 2800 3200 3600 0 5 10 15 20 25 30 v ds , drain ? to ? source voltage (v) c, capacitance (pf) figure 7. capacitance variation t j = 25 c c oss c rss c iss v gs = 0 v 0 1 2 3 4 5 6 7 8 9 10 03 91215212427333642 figure 8. gate ? to ? source and drain ? to ? source voltage vs. total charge q g , total gate charge (nc) v gs , gate ? to ? source voltage (v) t j = 25 c v dd = 15 v v gs = 10 v i d = 30 a q t q gs q gd 1 10 100 1000 1 10 100 t r t d(off) t d(on) t f t, time ( ns ) figure 9. resistive switching time variation vs. gate resistance r g , gate resistance ( ) v dd = 15 v i d = 15 a v gs = 10 v v sd , source ? to ? drain voltage (v) v gs = 0 v figure 10. diode forward voltage vs. current t j = 25 c t j = 125 c i s , source current (a) 0.01 1 10 100 1000 0.1 1 10 100 figure 11. maximum rated forward biased safe operating area v ds , drain ? to ? source voltage (v) i d , drain current (a) r ds(on) limit thermal limit package limit v gs = 20 v single pulse t c = 25 c 1 ms 100 s 10 ms dc 0 10 20 30 40 50 60 70 80 90 100 25 50 75 100 125 150 t j , starting junction temperature ( c) figure 12. maximum avalanche energy vs. starting junction temperature e as , single pulse drain ? to ? source avalanche energy (mj) i d = 44 a 0 5 10 15 20 25 30 0.4 0.5 0.6 0.7 0.8 0.9 1.0 45 6183039 0.1 10 s
NTMFS4936N http://onsemi.com 6 typical characteristics 0.001 0.01 0.1 1 10 100 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 0.1 0.2 0.02 d = 0.5 0.05 0.01 single pulse r(t) ( c/w) t, time ( s) figure 13. thermal response 0 10 20 30 40 50 60 70 80 90 100 0 10 20 304050 60 708090 i d , (a) figure 14. gfs vs. i d gfs (s)
NTMFS4936N http://onsemi.com 7 package dimensions dfn5 5x6, 1.27p (so8 fl) case 488aa ? 01 issue d style 1: pin 1. source 2. source 3. source 4. gate 5. drain 6. drain m 3.00 3.40 0 ??? 3.80 12 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeter. 3. dimension d1 and e1 do not include mold flash protrusions or gate burrs. 1234 top view side view bottom view d1 e1 d e 2 2 b a 0.20 c 0.20 c 2 x 2 x dim min nom millimeters a 0.90 1.00 a1 0.00 ??? b 0.33 0.41 c 0.23 0.28 d 5.15 bsc d1 4.50 4.90 d2 3.50 ??? e 6.15 bsc e1 5.50 5.80 e2 3.45 ??? e 1.27 bsc g 0.51 0.61 k 0.51 ??? l 0.51 0.61 l1 0.05 0.17 a 0.10 c 0.10 c detail a 14 l1 e/2 8x d2 g e2 k b a 0.10 b c 0.05 c l detail a a1 e 3 x c 4 x c seating plane max 1.10 0.05 0.51 0.33 5.10 4.22 6.10 4.30 0.71 ??? 0.71 0.20 m *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1.270 2x 0.750 1.000 0.905 0.475 4.530 1.530 4.560 0.495 3.200 1.330 0.965 2x 2x 3x 4x 4x pin 5 (exposed pad) on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 NTMFS4936N/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loca l sales representative
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